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          1. No Items SPEC
            1 Trace Width/Space 35μm /35μm
            2 Trace Width Tolerance ±10%
            3 Distance between Pad and Conductor 0.075mm
            4 Distance between Board Edge and Conductor 0.15mm
            5 Min. Pad Size 0.2*0.2mm
            6 PTH Pad Size 0.25mm
            7 Min. PTH Aperture 0.05mm
            8 Registration of Silk-Screen ±0.075mm
            9 Tolerance of External Dimension ±0.05mm
            10 Tolerance of Aperture ±0.015mm
            11 Registration of Hole ±0.025mm
            12 Thickness of Ni Plating 1μm-5μm
            13 Thickness of Au Plating 0.05μm-0.2μm
            14 Maximum Layer 8 Layers



            項目 量產能力
            Chip器件 可加工最小尺寸電阻、電容電感 0201
            SMT加工直通率 99.95%
            連接器 可加工最小Pitch 連接器 0.4mm
            SMT加工直通率 99.80%
            BGA 可加工最小Pitch BGA器件 0.4mm
            SMT加工直通率 99.80%
            QFN 可加工最小Pitch QFN器件 0.4mm
            SMT加工直通率 99.80%
            LED LED燈貼裝角度精度 ±1°
            SMT加工直通率 99.90%
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